Harpak-ULMA Packaging, PTC and Rockwell Automation partner to demonstrate the power of augmented reality for human productivity and downtime avoidance BOSTON--(BUSINESS WIRE)--Harpak-ULMA and Rockwell ...

RUIAN, ZHEJIANG, CHINA, January 16, 2026 /EINPresswire.com/ — The global packaging industry is undergoing a period of rapid transformation as manufacturers respond ...

Vention introduces a platform-powered "one-stop-shop" end-of-line packaging solution, through its unified hardware and software manufacturing automation platform The portfolio includes case packing, ...

Attendees at this year’s Packaging Automation Forum got the scoop from experts at some of the industry’s best-known consumer products companies. Packaging Automation Forum event 2010, Chicago, IL.

Some lessons learned the hard way might help someone who has just received the task of automating or tuning a packaging line and hasn’t had that experience yet. First of all, I would recommend that ...

BOSTON--(BUSINESS WIRE)--Harpak-ULMA and Rockwell Automation (RA) joined with PTC to reveal the newest product of their continuing collaboration. The automated, AR-enabled packaging line demonstration ...

MONTREAL, Feb. 17, 2026 /PRNewswire/ - Vention, creator of the world's only full-stack automation platform and hardware ecosystem, today announced expanded end-of-line packaging automation ...