Semiconductor Engineering

Reducing Rework In CMP: An Enhanced Machine Learning-Based Hybrid Metrology Approach

The semiconductor industry is constantly marching toward thinner films and complex geometries with smaller dimensions, as well as newer materials. The number of chemical mechanical planarization (CMP) ...
EDN

Applied announces low down-force, low-k CMP machine

SANTA CLARA, Calif. — Applied Materials Inc. has announced the Reflexion LK chemical mechanical polishing (CMP) system, a machine that has a “low down-force” and is intended to planarize a range of ...
EDN

Nova claims CMP measurement machine is fastest

REHOVOTH, Israel — The NovaScan 3060, from Nova Measuring Instruments Ltd., is a measurement system for chemical mechanical polishing (CMP) applications with an overall measurement time of 13 seconds ...
Electronic Design

Make the Move to Machine Learning, Neural Networks for CMP Modeling

Use of machine learning and feed-forward neural networks presents a new and exciting opportunity to develop high-accuracy CMP models of complex, advanced deposition processes. Machine learning (ML), ...