This new technical paper titled “End-to-end deep learning framework for printed circuit board manufacturing defect classification” is from researchers at École de technologie supérieure (ÉTS) in ...

The small and complicated features of TSVs give rise to different defect types. Defects can form during any of the TSV process steps, which include lithography patterning followed by deep reactive ion ...

As electronic products move from prototyping to mass production, manufacturers must rely on efficient, scalable, and ...

Most electronic assembly lines produce some defects, or faults. For example, solder-paste printers may deposit excess, smudged, or insufficient quantities of solder, and component pick-and-place ...

In the competitive world of electronics manufacturing, a profound truth often goes unrecognized until expensive lessons force ...

Geopolitical tensions and pandemic-related disruptions have revealed deep vulnerabilities within the supply chain for manufacturers as well as the businesses and governments that rely on them. In ...

AXI is an effective technology for finding manufacturing defects in electronics assembly operations. Manufacturers of advanced electronics products know that simultaneously producing a ...

Manufacturing challenges below 8mil. When drill to trace spacing falls below 8 mil, the PCB moves into a far more complex manufacturing zone. Standard mechanical drilling is often insufficient, and ...

The evolution of PCBs from large and antiquated “printed wiring boards” to today’s fine-line designs on high-density interconnect (HDI) PCBs, IC substrates (ICS) and more, has been matched by ...