The main objective of this project is to let students apply the image processing techniques that been taught in class in a given conditions based on their title. This particular project involved the ...

This new technical paper titled “End-to-end deep learning framework for printed circuit board manufacturing defect classification” is from researchers at École de technologie supérieure (ÉTS) in ...

Siemens has acquired Aster Technologies, a privately held company in the printed circuit board market. Aster produces test verification and engineering software. This strategic move integrates Aster’s ...

The small and complicated features of TSVs give rise to different defect types. Defects can form during any of the TSV process steps, which include lithography patterning followed by deep reactive ion ...

There is an expectation from consumers that today’s electronic products will just work and that electronic manufacturers have continued to improve the quality of their products. In most cases, this ...

The evolution of PCBs from large and antiquated “printed wiring boards” to today’s fine-line designs on high-density interconnect (HDI) PCBs, IC substrates (ICS) and more, has been matched by ...