The role of packaging/assembly/test (P/A/T) in the overall successful commercialization of MEMS (microelectromechanical systems) has historically taken a backseat to device development. In the ...
Lam Research (NasdaqGS:LRCX) has reportedly held takeover talks with BE Semiconductor Industries (BESI). The discussions point to potential M&A activity that could affect the semiconductor equipment ...
As the core technology used in modern electronics manufacturing, surface-mount technology (SMT) assembly density is increasing, the number of pins is increasing, and the pitch is decreasing. In ...
Wafer bumps need to be uniform in height to facilitate subsequent manufacturing steps, but a push for 100% inspection in packaging in mission-critical markets is putting a strain on existing ...
Many packaging companies are turning to systems that combine the stretch blow molding (SBM) process with the bottling process in a single production flow. Pneumatic technologies can solve PET ...
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