One of the most cutting-edge packaging technologies to recently emerge in the electronics marketplace is the quad flat no leads (QFN)-type package. It serves as an alternative to the more costly ...
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[youtube=http://www.youtube.com/v/c_Qt5CtUlqY&hl=en_US&fs=1&] Take a few minutes to watch this amazingly informative video on how to solder QFN or MLF components ...
The new QFN socket from Ironwood Electronics features a unique contact design with outside spring and flat stamped plungers. The CBT-QFN-7056 provides a robust solution for burn-in and test ...
MicroLeadFrame (MLF)/ quad flat no-lead (QFN) packaging technology is the fastest growing IC packaging solution today. From a market segment perspective, MLF packaging solutions represent more than a ...
SINGAPORE--12 September 2012, UNITED STATES--(Marketwire - Sep 11, 2012) - STATS ChipPAC Ltd. ("STATS ChipPAC") (SGX-ST:STATSChP), a leading semiconductor test and advanced packaging service provider, ...
Taiwan suppliers of B2B networking chips are moving to adopt QFN technology for packing their products amid the growing shortage of substrates for FC (flip-chip) production, increasing business ...
With over 200 million motors produced every year with fractional horse power, the opportunity to save energy by adopting an electronically controlled variable speed solution is very significant. In ...
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