Die attach materials form the cornerstone of reliable power electronic packaging, providing the essential bond between semiconductor devices and their substrates. Recent advances have focused on ...
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In this study, the layered anisotropic structure of β-Li₂TiO₃ enables preferential dislocation slip under high pressure, amplified by nanoscale stress concentration, driving plastic deformation to ...
Microwave cold sintering process (MW-CSP) was used to densify NaCl, KDP, MgMoO₄, Li₂MoO₄, and TiO₂ ceramics. Under the fundamental densification mechanisms dominated by the coupling of the transient ...
The power electronics industry is facing a problem in that, as the power handled by transistors increases to meet the needs of new applications, the packaging will increasingly struggle to remove the ...
A new techno-economic analysis shows that the energy intensive ceramic industry would gain both financial and environmental benefits if it moved to free the cold sintering process from languishing in ...
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