Struggling with overheating PCBs, airflow bottlenecks, or long thermal simulation runtimes? As power densities rise and form ...
Electronic packaging has continued to become more complex with higher device count, higher power densities and Heterogeneous Integration (HI) becoming more common. In the mobile space, systems that ...
The drive for better efficiency in the power electronics industry has generated enormous gains in the last few years. The design of power semiconductors has improved, silicon carbide (SiC) and gallium ...
29% of thermal engineers are having to compromise the accuracy of their simulations due to hardware limitations, according to The State of Thermal, a survey of over 170 thermal engineers conducted by ...
SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence Design Systems, Inc. (NASDAQ: CDNS) today expanded its presence in the system analysis and design market with the introduction of the Cadence ® Celsius ™ ...
Consumer electronics – tablets, smartphones and e-readers – is now leading the industry in growth. For system manufacturers and integrated circuit (IC) suppliers, the challenge involves keeping pace ...
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