This article discusses a new technique of coupling thermogravimetry to GC in order to automate the event-controlled or continuous characterization of gas emissions from biomass during thermal ...

Increasingly complex and heterogeneous architectures, coupled with the adoption of high-performance materials, are making it much more difficult to identify and test for thermal issues in advanced ...

Assessing individual components is the foremost step in system thermal analysis. A component's reported thermal-resistance data becomes the gauge for thermal evaluation and management. It is therefore ...

Rising chip and packaging complexity is causing a proportionate increase in thermal couplings, which can reduce performance, shorten the lifespan of chips, and impact overall reliability of chips and ...

Have you ever wondered what journey a piece of equipment or machinery took before ending up in space? Or what testing was done before the rocket’s blastoff? Or why a piece of equipment failed ...

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